Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 293 | Package substrates technology experts meeting for 2.1D Packaging | 관리자 | 2025-02-24 | 1,073 |
| 292 | 2025 SMTA Wafer Level Packaging Symposium | 관리자 | 2025-02-19 | 1,750 |
| 291 | MOU with SIPC | 관리자 | 2025-02-14 | 323 |
| 290 | 2025 em |
관리자 | 2025-01-20 | 1,573 |
| 289 | 2024 COSD Performance Sharing Meeting | 관리자 | 2024-12-20 | 1,076 |
| 288 | R&D Workshop for Low Dk & Df material and Semiconductor BIB(Burn-In-Board) test ... | 관리자 | 2024-12-11 | 1,152 |
| 287 | R&D Workshop on the Development of Substrate Materials Technology for Ultra-High-... | 관리자 | 2024-12-09 | 1,180 |
| 286 | Training program for semiconductor packaging engineers | 관리자 | 2024-12-05 | 1,247 |
| 285 | General meeting and conference of the de facto standardization forum | 관리자 | 2024-12-04 | 1,117 |
| 284 | KPDFIA-KPIA business cooperation | 관리자 | 2024-11-29 | 1,273 |
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관리자 2025-02-24 Hit 1,073
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관리자 2025-02-19 Hit 1,750
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관리자 2025-02-14 Hit 323
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관리자 2025-01-20 Hit 1,573
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관리자 2024-12-20 Hit 1,076
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관리자 2024-12-11 Hit 1,152
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관리자 2024-12-09 Hit 1,180
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관리자 2024-12-05 Hit 1,247
-
관리자 2024-12-04 Hit 1,117
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관리자 2024-11-29 Hit 1,273