| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 63 | MOU with SeongSan HighTech | 관리자 | 2021-09-13 | 719 |
| 62 | MOU with YMT Co., Ltd. | 관리자 | 2021-09-13 | 710 |
| 61 | Packaging Integration Experts Meeting | 관리자 | 2021-09-13 | 1,310 |
| 60 | MOU with HOJIN PLATECH Co., Ltd. | 관리자 | 2021-09-13 | 734 |
| 59 | A Ground-breaking mtg of the Technical Support Center for Semiconductor Converge... | 관리자 | 2021-09-13 | 663 |
| 58 | JKC technical experts meeting | 관리자 | 2021-09-13 | 1,296 |
| 57 | FOP, SiC, Packaging Technology Seminar | 관리자 | 2021-09-13 | 1,312 |
| 56 | MOU with Cheongju University IACF | 관리자 | 2021-09-13 | 726 |
| 55 | MOU with NEPES CO., LTD. | 관리자 | 2021-09-13 | 702 |
| 54 | MOU with GDS CO., LTD. | 관리자 | 2021-09-13 | 729 |