Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 93 | MOU with FindeaChip Co., Ltd. | 관리자 | 2021-09-13 | 679 |
| 92 | MOU with ibest | 관리자 | 2021-09-13 | 682 |
| 91 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 1,369 |
| 90 | Designated as an IEC TC91 Electronics Assembly Technology | 관리자 | 2021-09-13 | 662 |
| 89 | JKC technical committee | 관리자 | 2021-09-13 | 1,330 |
| 88 | Symposium : Packaging Integration Technology | 관리자 | 2021-09-13 | 1,325 |
| 87 | Semiconductor Packaging Integration Technology Center Promotion | 관리자 | 2021-09-13 | 655 |
| 86 | ‘Semiconductor Packaging Integration Technology Center’ completed | 관리자 | 2021-09-13 | 658 |
| 85 | COSD signboard hanging ceremony | 관리자 | 2021-09-13 | 696 |
| 84 | JKC technical committee | 관리자 | 2021-09-13 | 1,268 |
-
관리자 2021-09-13 Hit 679
-
관리자 2021-09-13 Hit 682
-
관리자 2021-09-13 Hit 1,369
-
관리자 2021-09-13 Hit 662
-
관리자 2021-09-13 Hit 1,330
-
관리자 2021-09-13 Hit 1,325
-
관리자 2021-09-13 Hit 655
-
관리자 2021-09-13 Hit 658
-
관리자 2021-09-13 Hit 696
-
관리자 2021-09-13 Hit 1,268