Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 103 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 1,607 |
| 102 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 1,407 |
| 101 | Semiconductor Packaging Integration technology equipment development meeting | 관리자 | 2021-09-13 | 1,409 |
| 100 | MOU with SANICO Co., Ltd. | 관리자 | 2021-09-13 | 697 |
| 99 | Packaging Integration Standard Expert Meeting | 관리자 | 2021-09-13 | 1,284 |
| 98 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 1,340 |
| 97 | MOU with KIEEME | 관리자 | 2021-09-13 | 665 |
| 96 | MOU with MICROINSPECTION Co., Ltd. | 관리자 | 2021-09-13 | 663 |
| 95 | JDA(Joint Development Agreement) with SIMMTECH CO.,Ltd, COMS CO.,Ltd | 관리자 | 2021-09-13 | 865 |
| 94 | MOU with NOWTECH Co., Ltd. | 관리자 | 2021-09-13 | 691 |
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관리자 2021-09-13 Hit 1,607
-
관리자 2021-09-13 Hit 1,407
-
관리자 2021-09-13 Hit 1,409
-
관리자 2021-09-13 Hit 697
-
관리자 2021-09-13 Hit 1,284
-
관리자 2021-09-13 Hit 1,340
-
관리자 2021-09-13 Hit 665
-
관리자 2021-09-13 Hit 663
-
관리자 2021-09-13 Hit 865
-
관리자 2021-09-13 Hit 691