Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 133 | IEC TC91 Professional Committee – Zoom | 관리자 | 2021-09-13 | 2,314 |
| 132 | MOU with skydiamond | 관리자 | 2021-09-13 | 714 |
| 131 | MOU with LEO | 관리자 | 2021-09-13 | 664 |
| 130 | Symposium Packaging Integration | 관리자 | 2021-09-13 | 1,529 |
| 129 | Inter-ministerial KICK-OFF workshop for materials and parts development business | 관리자 | 2021-09-13 | 762 |
| 128 | JDA with IMAGIS, NOVASEMI, ATK | 관리자 | 2021-09-13 | 657 |
| 127 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 1,413 |
| 126 | Material parts development business KICK-OFF workshop | 관리자 | 2021-09-13 | 651 |
| 125 | MOU with HAESUNG DS | 관리자 | 2021-09-13 | 711 |
| 124 | MOU with me |
관리자 | 2021-09-13 | 689 |
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관리자 2021-09-13 Hit 2,314
-
관리자 2021-09-13 Hit 714
-
관리자 2021-09-13 Hit 664
-
관리자 2021-09-13 Hit 1,529
-
관리자 2021-09-13 Hit 762
-
관리자 2021-09-13 Hit 657
-
관리자 2021-09-13 Hit 1,413
-
관리자 2021-09-13 Hit 651
-
관리자 2021-09-13 Hit 711
-
관리자 2021-09-13 Hit 689