Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 143 | 2021-2 IEC TC91 International Standard Meeting | 관리자 | 2021-11-24 | 1,203 |
| 142 | MOU with JPCA | 관리자 | 2021-11-15 | 691 |
| 141 | Advanced Packaging Integration Technology international symposium ('21.11/09-10) | 관리자 | 2021-11-15 | 2,160 |
| 140 | [Mounting Technology Seminar] 5G&6G Communication Parts and Materials Mounting T... | 관리자 | 2021-10-29 | 1,686 |
| 139 | MOU with Yole | 관리자 | 2021-10-13 | 694 |
| 138 | MOU with Hanbat University | 관리자 | 2021-09-27 | 667 |
| 137 | MOU with KSCM | 관리자 | 2021-09-27 | 679 |
| 136 | Semiconductor Packaging Integration Technology Seminar | 관리자 | 2021-09-15 | 1,541 |
| 135 | Electronics technology standard seminar | 관리자 | 2021-09-15 | 1,489 |
| 134 | MOU with KSCM | 관리자 | 2021-09-13 | 657 |
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관리자 2021-11-24 Hit 1,203
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관리자 2021-11-15 Hit 691
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관리자 2021-11-15 Hit 2,160
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관리자 2021-10-29 Hit 1,686
-
관리자 2021-10-13 Hit 694
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관리자 2021-09-27 Hit 667
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관리자 2021-09-27 Hit 679
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관리자 2021-09-15 Hit 1,541
-
관리자 2021-09-15 Hit 1,489
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관리자 2021-09-13 Hit 657