Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 163 | MOU with FAR EAST UNIVERSITY | 관리자 | 2022-05-23 | 677 |
| 162 | Semiconductor fusion component mounting technology exchange meeting and integrat... | 관리자 | 2022-05-23 | 683 |
| 161 | IPC SummerCom 2022 | 관리자 | 2022-05-23 | 1,374 |
| 160 | JIC CONFERENCE 2022_SPRING | 관리자 | 2022-05-18 | 1,303 |
| 159 | MOU with IPITECH | 관리자 | 2022-05-10 | 639 |
| 158 | MOU with KOPEA | 관리자 | 2022-04-25 | 685 |
| 157 | Packaging integration industry de facto standard(IPC) forum Kick-off ceremony | 관리자 | 2022-04-20 | 1,303 |
| 156 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2022-04-19 | 1,282 |
| 155 | [Packaging Integration technology seminar] Major technology issue and standard t... | 관리자 | 2022-04-18 | 1,665 |
| 154 | [Packaging Integration technology seminar] High-speed Substrate material technol... | 관리자 | 2022-04-18 | 1,522 |
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관리자 2022-05-23 Hit 677
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관리자 2022-05-23 Hit 683
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관리자 2022-05-23 Hit 1,374
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관리자 2022-05-18 Hit 1,303
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관리자 2022-05-10 Hit 639
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관리자 2022-04-25 Hit 685
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관리자 2022-04-20 Hit 1,303
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관리자 2022-04-19 Hit 1,282
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관리자 2022-04-18 Hit 1,665
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관리자 2022-04-18 Hit 1,522