Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 193 | 2022 COSD Project Results | 관리자 | 2022-12-22 | 666 |
| 192 | 2022-2 IEC TC91 International Standard Meeting | 관리자 | 2022-11-16 | 1,277 |
| 191 | [Advanced Packaging Symposium] Semiconductor Advanced Packaging Technology Sympo... | 관리자 | 2022-11-07 | 1,634 |
| 190 | IEC TC91 (Electronic Assembly Technology) Expert Committee | 관리자 | 2022-11-01 | 1,408 |
| 189 | PCB Materials' technology for high speed communication | 관리자 | 2022-10-28 | 707 |
| 188 | 2022 Semiconductor Experts Forum | 관리자 | 2022-10-26 | 1,351 |
| 187 | MOU with EV Advanced Materials | 관리자 | 2022-10-26 | 660 |
| 186 | Semiconductor packaging integration De facto standard(IPC) Forum experts meeting... | 관리자 | 2022-10-24 | 1,318 |
| 185 | JPCA-KPIA Semiconductor packaging integration seminar | 관리자 | 2022-10-19 | 1,568 |
| 184 | MOU with BKelectron | 관리자 | 2022-10-06 | 673 |
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관리자 2022-12-22 Hit 666
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관리자 2022-11-16 Hit 1,277
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관리자 2022-11-07 Hit 1,634
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관리자 2022-11-01 Hit 1,408
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관리자 2022-10-28 Hit 707
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관리자 2022-10-26 Hit 1,351
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관리자 2022-10-26 Hit 660
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관리자 2022-10-24 Hit 1,318
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관리자 2022-10-19 Hit 1,568
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관리자 2022-10-06 Hit 673