Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 223 | MOU with TLB | 관리자 | 2023-09-05 | 744 |
| 222 | ASPS 2023, Advanced Semiconductor Packaging Show 2023 | 관리자 | 2023-08-31 | 816 |
| 221 | MOU with CMP | 관리자 | 2023-08-29 | 682 |
| 220 | R&D project workshop for High-speed board materials | 관리자 | 2023-08-28 | 1,575 |
| 219 | MOU with EXPORUM | 관리자 | 2023-08-16 | 656 |
| 218 | Electronics packaging integration technology and market seminar | 관리자 | 2023-07-28 | 1,616 |
| 217 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2023-07-28 | 1,591 |
| 216 | LAB (Laser Assisted Bonding) Technical Committee | 관리자 | 2023-07-27 | 1,360 |
| 215 | Experts and steering committee joint meeting for IPC forum | 관리자 | 2023-07-27 | 1,469 |
| 214 | MOU with J-EXPO | 관리자 | 2023-07-25 | 734 |
-
관리자 2023-09-05 Hit 744
-
관리자 2023-08-31 Hit 816
-
관리자 2023-08-29 Hit 682
-
관리자 2023-08-28 Hit 1,575
-
관리자 2023-08-16 Hit 656
-
관리자 2023-07-28 Hit 1,616
-
관리자 2023-07-28 Hit 1,591
-
관리자 2023-07-27 Hit 1,360
-
관리자 2023-07-27 Hit 1,469
-
관리자 2023-07-25 Hit 734