Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 233 | [News] Standard by KPIA become an international standard for Packaging Integrati... | 관리자 | 2023-11-08 | 716 |
| 232 | IEC TC91 (Electronics Assembly Technology) Experts Committee | 관리자 | 2023-10-31 | 1,431 |
| 231 | De facto International Standards (IPC) Forum in electronic assembly technology | 관리자 | 2023-10-31 | 1,456 |
| 230 | 25th Semiconductor Exgibition 2023 | 관리자 | 2023-10-30 | 668 |
| 229 | Advanced Electronic Mounting Technology and Market Seminar II | 관리자 | 2023-10-30 | 1,685 |
| 228 | Advanced electronic packaging technology and market seminar l | 관리자 | 2023-10-30 | 1,724 |
| 227 | Technology market and standards seminar by electronics industry | 관리자 | 2023-10-30 | 1,673 |
| 226 | 2023 COSD regular meeting | 관리자 | 2023-09-25 | 686 |
| 225 | Korea-Japan Cooperation meeting | 관리자 | 2023-09-18 | 671 |
| 224 | MOU with MK Chem and Tech | 관리자 | 2023-09-07 | 736 |
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관리자 2023-11-08 Hit 716
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관리자 2023-10-31 Hit 1,431
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관리자 2023-10-31 Hit 1,456
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관리자 2023-10-30 Hit 668
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관리자 2023-10-30 Hit 1,685
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관리자 2023-10-30 Hit 1,724
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관리자 2023-10-30 Hit 1,673
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관리자 2023-09-25 Hit 686
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관리자 2023-09-18 Hit 671
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관리자 2023-09-07 Hit 736