Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 243 | MOU with ULSAN COLLEGE | 관리자 | 2024-01-30 | 595 |
| 242 | em |
관리자 | 2024-01-16 | 876 |
| 241 | MOU with KTC(Korea Testing Certification Institute) | 관리자 | 2023-12-19 | 766 |
| 240 | MOU with IEEC(Integrated Electronics Engineering Center) | 관리자 | 2023-12-18 | 655 |
| 239 | MOU with TONGMYONG UNIVERSITY | 관리자 | 2023-11-22 | 643 |
| 238 | R&D Workshop on Substrate Material Technology Development Project for High-Speed... | 관리자 | 2023-11-20 | 1,408 |
| 237 | MOU with PCEA(Printed Circuit Engineering Association) | 관리자 | 2023-11-13 | 740 |
| 236 | ICAE2023 : Advanced Packaging Integration Technology | 관리자 | 2023-11-10 | 2,596 |
| 235 | IEC TC91 (Electronics Assembly Technology) 2023 Jeju Meeting | 관리자 | 2023-11-10 | 1,463 |
| 234 | [NEWS] KPIA holds IEC TC91 international standards meeting in Jeju | 관리자 | 2023-11-10 | 650 |
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관리자 2024-01-30 Hit 595
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관리자 2024-01-16 Hit 876
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관리자 2023-12-19 Hit 766
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관리자 2023-12-18 Hit 655
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관리자 2023-11-22 Hit 643
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관리자 2023-11-20 Hit 1,408
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관리자 2023-11-13 Hit 740
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관리자 2023-11-10 Hit 2,596
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관리자 2023-11-10 Hit 1,463
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관리자 2023-11-10 Hit 650